The Flexible Printed Circuit Laser Drilling Machine is an advanced high-precision laser system developed by Inte Laser for FPC (Flexible Printed Circuit) and rigid-flex board manufacturing. It is designed to drill micro-holes and via-holes with extreme accuracy, enabling next-generation miniaturized, high-density electronic devices.
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The Double-Head Roll-to-Sheet (Roll-to-Roll) Hand Cover Film Laser Cutting Equipment is a high-speed, high-precision, and fully automated laser processing system specifically designed for the cutting of hand cover films and protective films used in electronic circuit production. With a dual-laser-head configuration, this equipment allows simultaneous cutting on two working tracks, dramatically improving productivity and material utilization.
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The Single Platform / Dual Platform Laser Cutting Machine is a next-generation high-precision laser processing system developed specifically for electronic circuit board cutting and fine pattern separation. This equipment provides exceptional accuracy, stability, and efficiency, enabling high-quality processing for materials such as FPC, PCB, coverlays, PI films, PET, copper foils, and laminated composites.
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The Automatic Laser SD Card Cutting Machine is a high-precision, fully automated laser cutting solution developed specifically for the electronic circuit and memory card manufacturing industry. It is designed to perform accurate cutting, trimming, and separation of SD card substrates (including plastic, resin, PCB, and composite materials) with exceptional speed and consistency.
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The FPC Window Cutting Equipment is a cutting-edge laser processing system designed for precision window opening on flexible printed circuit (FPC) boards. It utilizes high-speed, non-contact laser technology to accurately cut or remove specific areas of the FPC’s insulating layer, exposing copper traces or pads for subsequent processes such as bonding, welding, or component assembly.
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The Fully Automatic Laser Marking Machine is a cutting-edge solution developed by Inte Laser for high-speed and high-precision marking of electronic circuits, PCBs, and microelectronic components. This system adopts advanced laser technology to perform non-contact, permanent marking on a wide variety of materials, including copper, aluminum, FR4, polyimide, and ceramics.
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The Fully Automatic Laser Splitting Machine is a state-of-the-art laser depaneling system designed for high-precision cutting and separation of PCB, FPC, and other electronic circuit boards.Developed by Inte Laser’s advanced R&D division, this system combines laser micromachining technology, intelligent motion control, and fully automated operation to achieve clean, burr-free, and stress-free cutting.
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The Large Format Glass Laser Cutting Machine is an advanced high-precision laser system specifically developed for large-size glass, sapphire, and ceramic materials.As part of Inte Laser’s Hard and Brittle Material Product Line, this system offers non-contact, clean, and ultra-precise laser cutting suitable for display panels, touchscreens, optical glass, photovoltaic glass, and cover plates.
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The High-Precision Glass Laser Drilling Machine is one of Inte Laser’s advanced solutions in the Hard and Brittle Material Product Line. This equipment is specifically developed for micron-level laser drilling and micro-hole processing on various types of glass substrates — including soda-lime glass, borosilicate glass, tempered glass, quartz glass, and sapphire.
Send InquiryWe also provide the OEM, Meanwhile, we are professional manufacture of laser machines, so we can give you the best quality and the good price.
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E-mail: Info@intelaser.com.cn
Tel: +86-133 1693 4008
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