Product Introduction

By utilizing non-contact laser cutting technology, the machine ensures clean edges, no burrs, and zero mechanical stress, eliminating the need for traditional die-cutting methods.
This innovative approach not only enhances product quality but also reduces waste, production downtime, and tool wear — making it an ideal choice for modern smart electronics and digital storage production lines.

Working Principle

The Automatic Laser SD Card Cutting Machine employs a high-energy laser beam controlled by advanced galvanometer scanning and precision motion systems.
The laser beam focuses on the SD card substrate to perform rapid, clean, and accurate cuts, guided by intelligent vision alignment.

The integrated CCD visual positioning system and automatic focus adjustment ensure that each cutting path is perfectly aligned with the printed or molded SD card outlines.
The result is ultra-smooth edges and uniform shapes, ensuring compatibility with subsequent assembly and packaging processes.

Advantages

Dual optical path system adopted with high cutting efficiency and high accuracy;

Stable, compact system with low power consumption;

Automatic product feeding, detection and cutting;

Intelligent CCD vision system, good beam quality and good product cutting surface.

Technical Parameters

Sample Display

Product Features

Fully Automated Cutting System
From material feeding to laser cutting and unloading, all steps are automatically controlled, ensuring stability and continuous high-volume production.

High Precision & Clean Edges
The laser cutting accuracy reaches micron levels, producing smooth edges without mechanical burrs or deformation.

Non-Contact Processing
Laser cutting eliminates tool pressure and friction, maintaining substrate integrity and preventing microcracks.

CCD Visual Alignment
Built-in vision recognition system ensures exact alignment between the cutting path and printed SD card pattern, enhancing product yield.

Stable Performance & High Efficiency
The intelligent motion control platform enables high-speed operation with excellent repeatability and minimal thermal effect.

Flexible Material Compatibility
Suitable for a wide range of SD card materials, including ABS, PC, PVC, PET, FR4, and composite laminates used in electronic circuits.

Eco-Friendly Production
No blades, dust, or chemical residues — supports cleanroom compatibility and sustainable manufacturing standards.

Intelligent Operation Interface
User-friendly software interface supports recipe management, production monitoring, and automatic report generation.

Low Maintenance & Long Service Life
With durable components and advanced cooling design, the system ensures long-term stability and minimal downtime.

Applications

The Automatic Laser SD Card Cutting Machine is designed for precision cutting, shaping, and singulation of SD and microSD card components, widely used in:

Electronic circuit board manufacturing – high-accuracy cutting of PCB and FPC SD card bases

Memory card production – SD, microSD, and TF card shaping and singulation

Consumer electronics – mobile phones, cameras, and portable storage device manufacturing

Smart device modules – IoT components, sensor modules, and embedded flash memory boards

Precision electronics packaging – fine cutting for microelectronic assembly and encapsulation lines

Its superior accuracy and speed make it ideal for mass production environments, ensuring both quality consistency and cost efficiency.

Technology Highlights

The system integrates Inte Laser’s proprietary optical path design and high-precision motion control technology.
Equipped with ultra-fast scanning galvanometers and real-time energy feedback systems, the machine delivers outstanding laser stability and uniform cutting performance.

Advanced automation enables auto-calibration, fault detection, and laser power optimization, ensuring consistent quality even in long production cycles.
The modular mechanical design also supports customization for different SD card formats and layouts, giving manufacturers flexible scalability for future product lines.

FAQs (Frequently Asked Questions)

Q1: What materials can the Automatic Laser SD Card Cutting Machine process?
A1: It is suitable for materials such as ABS, PC, PET, PVC, FR4, and multilayer composite boards used in SD and microSD card production.

Q2: How accurate is the laser cutting process?
A2: The cutting precision can reach micron-level accuracy, ensuring perfect dimensional consistency and smooth, burr-free edges.

Q3: Can this equipment handle different SD card sizes?
A3: Yes, the system is fully customizable to accommodate various SD, microSD, or custom memory card dimensions and layouts.

Q4: How does laser cutting compare to traditional die-cutting?
A4: Laser cutting is faster, more precise, and non-contact — it avoids tool wear, deformation, and material contamination.

Q5: Is the machine suitable for mass production?
A5: Absolutely. It’s designed for 24/7 automated operation, ensuring stable output, low maintenance, and consistent quality.

Q6: What safety features are included?
A6: The equipment includes a fully enclosed design, laser protection window, and automatic interlock systems to ensure operator safety.

Q7: Does Inte Laser provide overseas installation and service?
A7: Yes. Inte Laser offers on-site installation, technical training, and continuous overseas after-sales support for global customers.