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Automated laser delamination equipment

Automated Laser Delamination Equipment Automated laser delamination equipment is an advanced manufacturing solution designed to precisely remove or separate thin layers of material using laser technology. This equipment is widely used in industries such as electronics, semiconductors, and flexible display manufacturing, where high precision and minimal thermal damage are critical. By leveraging automated control systems, laser delamination enhances efficiency, repeatability, and yield in production processes. Key Features and Technology 1. Laser Precision and Control The system utilizes high-energy lasers, such as UV, green, or infrared lasers, to selectively ablate or weaken adhesive layers between substrates. The laser beam is focused to a fine spot size, enabling micron-level accuracy without damaging underlying layers. Advanced optical systems and galvanometer scanners ensure rapid and precise beam positioning. 2. Automation and Process Integration Fully automated operation reduces human intervention, improving consistency and throughput. The equipment integrates robotic handling, vision alignment systems, and real-time monitoring to adjust laser parameters dynamically. This ensures optimal delamination quality across varying material properties. 3. Non-Contact and Clean Processing Unlike mechanical delamination methods, laser-based systems eliminate physical wear and contamination risks. The non-contact process minimizes stress on delicate materials, making it ideal for ultrathin films, flexible circuits, or OLED displays. 4. Adaptability and Customization The equipment can be tailored for different materials (polymers, metals, composites) and applications (debonding, lift-off, or surface cleaning). Software-controlled parameters (power, pulse duration, scan speed) allow fine-tuning for specific process requirements. Applications - Electronics Manufacturing: Delaminating temporary carriers from semiconductor wafers or flexible PCBs. - Display Production: Separating glass or polymer substrates in OLED/LCD fabrication. - Energy Storage: Processing battery electrodes or fuel cell components with minimal thermal impact. Advantages Over Traditional Methods - Higher precision and repeatability. - Reduced material waste and lower defect rates. - Scalability for high-volume production. Conclusion Automated laser delamination equipment represents a cutting-edge solution for modern manufacturing challenges. Its combination of precision, automation, and versatility makes it indispensable in industries requiring ultra-fine material processing. As technology advances, further improvements in speed, energy efficiency, and integration with smart factories will continue to expand its applications.

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  • Fully Automated Laser Passivation Layer Oelamination Machine

    Fully Automated Laser Passivation Layer Oelamination Machine

    Category: New energy product line
    Browse number: 15
    Number:
    Release time: 2025-11-07 14:34:50
    The Fully Automated Laser Passivation Layer Delamination Machine is a next-generation laser processing system designed for high-precision, high-speed, and automated removal of passivation layers in advanced electronic and semiconductor manufacturing. Developed by Shenzhen Inte Laser Technology Co., Ltd., this equipment represents the company’s continuous innovation in automated high-precision laser applications, integrating state-of-the-art optical systems, motion control, and intelligent automation technology.

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